Pushing Boundaries: ZYGO Introduces Widest FOV in Interferometry
Zygo, a business unit of AMETEK and a global leader in precision metrology and optical technologies, has introduced its revolutionary 0.5X ZWF (Zygo Wide Field) Objective — the industry’s widest commercially available interferometric objective in terms of field of view. Designed for high-speed, high-precision measurement tasks, this new objective aims to significantly enhance efficiency and accuracy across sectors like semiconductors, precision manufacturing, and photonics.
Invented and manufactured by them, the 0.5X ZWF Objective offers an unparalleled FOV of up to 60mm in a single measurement, allowing for significantly faster data acquisition without compromising measurement integrity. This advancement enhances their already formidable suite of metrology solutions, pushing the boundaries of performance for applications requiring large-area assessment and high-throughput production environments.
Sean Leavy, Product Manager at Zygo, underscores the objective’s transformative impact: “With the launch of the 0.5X ZWF Objective, Zygo is addressing a critical industry need for high-speed, large-area metrology. This new objective not only accelerates measurement processes but also enhances the precision required for increasingly complex components in cutting-edge industries like AR waveguides and semiconductor manufacturing.”
Designed for both laboratory and in-line production environments, the 0.5X ZWF Objective streamlines metrology workflows by enabling fast and precise measurements for single-FOV samples, reducing inspection times and significantly improving throughput. It facilitates seamless stitching of large surfaces, providing rapid and reliable flatness and waviness assessments. Additionally, the objective is optimized for superior film measurement, consistent with all Zygo objectives, making it a powerful tool for enhanced optical layer analysis.
Their 0.5X ZWF Objective is further enhanced by the company’s Mx software suite, featuring intelligent tools such as Part Finder and SmartSetUp, which simplify focus and alignment, ensuring repeatability and accuracy across expansive measurement areas. These innovations allow operators to measure large areas quickly and with confidence, minimizing manual intervention and maximizing efficiency.
Across industries, the impact of the 0.5X ZWF Objective is substantial. In semiconductor manufacturing, it can reduce stitch times by 75% for wafer topography. For precision machining, it delivers an optimal balance between lateral resolution and large-area coverage, making it ideal for flatness and mid-spatial frequency analysis of precision- machined components. In the field of photonics, the objective enables full-area, non- stitched measurements for stacked planar waveguides, determining layer thickness, air-gap distances, and individual layer forms in a single scan, significantly improving workflow efficiency.
With an optical resolution of 19.0 µm, a working distance of 45mm, and a slope limit of 0.67°, the 0.5X ZWF objective is engineered to provide unmatched metrology capabilities in the most demanding industrial environments. They continue to lead the way in precision optical metrology, offering solutions that combine speed, accuracy, and innovation. “This objective represents a major leap forward in Zygo’s commitment to providing the most advanced metrology tools available,” adds Leavy. “By eliminating traditional constraints associated with FOV limitations, we are empowering engineers and manufacturers to achieve new levels of efficiency and quality assurance.”
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